Description
Delivery Timeline:
This product is getting shipped from outside Australia. We estimate delivery within 8-12 working days across Australia, excluding weekends and public holidays.
Please note that this timeframe is subject to change due to unforeseen circumstances.
Features:
• Used to locate and relocate mobile phone PCB BGA parts
• Convenient and quick re-bombardment of BGA without causing any damage, suitable for iPhone 11/11 Pro / 11 Pro Max BGA repositioning and repair to provide solutions
• Unique hole design makes it easier to take out the formed solder balls
• Fast and convenient soldering
• Size: about 13x9x1.7cm
Package Includes:
• 1 x Findx F11 Mini Reballing Stencil Platform Jig Fixture for Iphone 11/11 Pro/11 Pro Max
